2022-2023 trade shows dates

Our teams will be present at various international trade fairs. Come to meet us, discover our machines and our latest technologies.

Here are the next trade shows we will participate:

PROPAK ASIA

???? Bangkok, Thailand

????15-18 June 2022

PACK EXPO

???? Chicago, USA

???? 23-26 October 2022

ALL4PACK

???? Paris, France

???? 21-24 November 2022

INTERPACK

???? Düsseldorf, Germany

???? 4-10 May 2023

by LuciePackR

Meet us at Propak Asia - June 2022

PROPAK ASIA, 2022

Propak Asia is the leading Asian trade event for processing and packaging technology.

The 29th International exhibition will be held from June 15th to 18th at the Bangkok International Trade Exhibition Center (BITEC) in Thailand.

You could meet us and we will have the pleasure to introduce to you our filling and capping machines.

Come to discover our latest technologies and exchange with us on your projects.
We will offer you all our expertise and know how to answer all your needs.

You can contact us at sales.asia@packr.com

by LuciePackR

Remote Assistance with HoloLens 2

PACK’R uses the HoloLens 2 mixed reality glasses to help with maintenance and/or installation

For a few years, we have been trying to adapt to our export challenges in order to meet the needs of our customers around the world as quickly as possible.

We therefore turned our attention to mixed reality, a combination of reality, augmented reality and virtual reality. The mixed reality has obvious advantages for industry.

Thus, we continue to support our customers through remote assistance coupled with our service offering. Since February 2020, at PACK’R, we have several pairs of Microsoft HoloLens 2 glasses.

Discover our service offer :
https://www.packr.com/technical-support/

by LuciePackR

PACK'R ASIA has moved!

The whole team now welcomes you in brand new premises, located at Block 4010 Ang Mo Kio Avenue 10, # 05-01 TECHPLACE 1, Singapore.
A new workshop and spacious offices to welcome employees and customers in a pleasant environment.